Computer on Module
Thursday, October 4th 2007 | Ismael Ghalimi
The development of the Redux Model 1 is switching to overdrive. Yesterday, we found a partner for the industrial design and the multi-touch interface. Today, we identified one for the Computer on Module, which is by far the most complex part of the overall project. Here is what it will look like.
In order to reduce risk and support parallel development for the device’s very many components, we decided to build the logic board in two parts: a Computer on Module integrating all the core components required for making a barebone Mobile Internet Device work (CPU, Video Controller, Wi-Fi Module), and a separate backplane that will host optional modules (Cellular Module and GPS Module especially). For the core Computer on Module, we selected Embedian, and are discussing the development of a custom Computer on Module based on the upcoming COM-7310. The following elements will be added to the main design:
- SM502 graphics co-processor supporting up to 1280 x 1024 resolution
- 802.11b/g and Bluetooth 2.0 support
- SD support with Linux drivers
They add to the following elements, which are already offered by the COM-7310:
- Samsung S3C6400
- ARM1176 Core, 533MHz Clock Speed, 266MHz Bus Speed
- Java Acceleration Engine
- 256MB DDR DRAM
- 1GB NAND Flash
- MPEG-4/H.263/H.264 Codec >30fps@SD/D1
- AC-97 Audio Codec Interface
- PCM Serial Audio Interface
- 3 x RS232
- USB 2.0 OTG
- USB 1.1 Host
- SD/SDHC
- 8-bit ITU 601/656 Camera Interface
- Support for Debian Linux
If all goes as planned, we should receive a pin-compatible Computer on Module based on the Samsung S3C2440 and the Silicon Motion SM502 for development by the end of the month, and a first prototype of our custom Computer on Module within four months, which will take us to early February.
While all this is happening, we are starting work on the industrial design and touchscreen interface. We selected the Toshiba LTD089EXWS display and should get a first prototype of the enclosure by the end of the month as well. This will allow us to get a feel for the form factor, and start working on the placement of the various backplane’s components, especially the connectors and ports that will require matching holes to be drilled into the encasing.
At present time, we are looking for contributors who could help with the design of the backplane. If you have experience with PCB and antenna design, especially related to 3G mobile phones and GPS navigation devices, please feel free to contact us.
Entry filed under: Office 2.0
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Ismael,
Go for 4G with the backplane option. 3G is obsolete. Also go for 802.11n.
Cheers
-Francis
Francis,
With our modular design for cellular connectivity, supporting 4G networks should be fairly easy once Novatel adds such support to its product line. Supporting 802.11n should not be a problem either, for I would expect pin-compatible chips form our supplier to be available by the time we need to make a final decision.
Best regards
-Ismael
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